ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,164, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Sang Cheon Park (Hwaseong-si, South Korea), Dae-Woo Kim (Seongnam-si, South Korea), Taehun Kim (Anyang-si, South Korea) and Hyuekjae Lee (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution substrate, a first memory chip provided on the redistribution substrate, the first memory chip comprising a first base layer, a first circuit layer provided on a top surface of the first base layer, and a first via penetrating the first base layer and connected...