ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,105, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Myungsam Kang (Hwaseong-si, South Korea), Youngchan Ko (Seoul, South Korea), Jeongseok Kim (Cheonan-si, South Korea), Kyung Don Mun (Hwaseong-si, South Korea) and Bongju Cho (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution substrate having a dielectric layer and a wiring pattern in the dielectric layer, the wiring pattern including a line part that extends horizontally, and a via part connected to the line part, the via part having a width les...