ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,106, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Hyeonjeong Hwang (Cheonan-si, South Korea), Kyoung Lim Suk (Suwon-si, South Korea), Seokhyun Lee (Hwaseong-si, South Korea) and Jaegwon Jang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises a first redistribution substrate including first interconnection layers sequentially stacked on each other, a semiconductor chip mounted on the first redistribution substrate, a mold layer disposed on the first redistribution substrate and surrounding the semiconductor chi...