US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Semiconductor device having package on package structure and method of manufacturing the semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,157, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device having package on package structure and method of manufacturing the semiconductor device" was invented by Jeonghyun Lee (Seoul, South Korea), Jihwang Kim (Cheonan-si, South Korea) and Jongbo Shim (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device having a package on package (PoP) structure, in which a fine pitch between package substrates is implemented, a total height of a package is reduced, and reliability is enhanced. The semiconductor package includes a first package substrate including a...