US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Semiconductor device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,558, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device and method of manufacturing the same" was invented by Jaeseoung Park (Seoul, South Korea), Wandon Kim (Seongnam-si, South Korea), Suyoung Bae (Daegu, South Korea), Dongsoo Lee (Gunpo-si, South Korea), Dongsuk Shin (Suwon-si, South Korea) and Doyoung Choi (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate including first and second regions, first and second active patterns provided on the first and second regions, respectively, a pair of first source/drain patterns on t...