US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Method for designing pattern layout including oblique edges and method for manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,164, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method for designing pattern layout including oblique edges and method for manufacturing semiconductor device using the same" was invented by Hungbae Ahn (Hwaseong-si, South Korea), Sangoh Park (Hwaseong-si, South Korea) and Jinho Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pattern layout design method includes performing optical proximity correction (OPC) for a mask layout, thereby creating a corrected layout. Creation of the corrected layout includes creating a first corrected layout through grid snapping for an obliq...