ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,021, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Apparatus and method for treating substrate" was invented by Hyun Bae Kim (Yongin-si, South Korea), Ji Hwan Kim (Hwaseong-si, South Korea), Hyong Seo Yoon (Suwon-si, South Korea), Sang Ki Nam (Seongnam-si, South Korea), Hyun Jae Lee (Seongnam-si, South Korea) and Myung Geun Jeong (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treatment apparatus including a chamber; a lower electrode in the chamber, wherein the substrate is on the lower electrode; an upper electrode in the chamber, and above the lower electrode; a p...