US Patent Issued to SAMSUNG ELECTRONICS on March 18 for "Semiconductor package and package-on-package including the same" (South Korean Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,160, issued on March 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and package-on-package including the same" was invented by Juyoun Choi (Hwaseong-si, South Korea), Eunjung Lee (Yongin-si, South Korea), Junho Lee (Suwon-si, South Korea) and Seungsoo Ha (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a pair of differential signal wiring lines including a first differential signal wiring line and a second differential signal wiring line, extending parallel to and spaced apart from each other, a lower equal potential plate in a lo...