US Patent Issued to SAMSUNG ELECTRONICS on March 18 for "Semiconductor device having a liner layer and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,564, issued on March 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device having a liner layer and method of fabricating the same" was invented by Jinbum Kim (Seoul, South Korea), Dahye Kim (Seoul, South Korea), Seokhoon Kim (Suwon-si, South Korea), Jaemun Kim (Seoul, South Korea), Ilgyou Shin (Seoul, South Korea), Haejun Yu (Osan-si, South Korea), Kyungin Choi (Seoul, South Korea), Kihyun Hwang (Seongnam-si, South Korea), Sangmoon Lee (Suwon-si, South Korea), Seung Hun Lee (Hwaseong-si, South Korea) and Keun Hwi Cho (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device ...