US Patent Issued to SAMSUNG ELECTRONICS on March 11 for "Semiconductor device including backside wiring structure with super via" (South Korean Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,557, issued on March 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).

"Semiconductor device including backside wiring structure with super via" was invented by Seung Ha Oh (Seoul, South Korea), Kwang Jin Moon (Hwaseong-si, South Korea) and Ho-Jin Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a substrate that including a frontside comprising an active region and a backside opposite to the frontside, an electronic element on the active region, a frontside wiring structure electrically connected to the electronic element on the frontside of the substrate, and a backside wir...