US Patent Issued to SAMSUNG ELECTRONICS on March 11 for "Method and apparatus for splitting data in multi-connectivity" (South Korean Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,134, issued on March 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method and apparatus for splitting data in multi-connectivity" was invented by Hee-su Im (Hwaseong-si, South Korea), Byung-seung Kim (Seongnam-si, South Korea) and Eun-jun Choi (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for multi-connectivity between a plurality of base stations and user equipment includes estimating, at the user equipment, a first round trip time (RTT) taken in transmitting first data to a first base station, estimating, at the user equipment, a second RTT taken in transmitting second data to a second ba...