US Patent Issued to SAMSUNG ELECTRONICS on March 11 for "Electronic device including heat dissipation sheet" (South Korean Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,798, issued on March 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Electronic device including heat dissipation sheet" was invented by Haein Chung (Suwon-si, South Korea), Kyungha Koo (Suwon-si, South Korea), Kangsik Kim (Suwon-si, South Korea) and Wonmin Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket wh...