US Patent Issued to SAMSUNG ELECTRONICS on June 3 for "Substrate for noise prevention and semiconductor package including the substrate" (South Korean Inventor)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,687, issued on June 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate for noise prevention and semiconductor package including the substrate" was invented by Kiwon Baek (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate is provided. The substrate includes a body layer that includes a signal area; a first wiring layer provided on a lower surface of the body layer, the first wiring layer including a plurality of first signal lines provided in the signal area and a first power line provided outside the signal area; and a second wiring layer provided on an upper surface of the body layer, ...