US Patent Issued to SAMSUNG ELECTRONICS on June 3 for "Semiconductor package including post" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,720, issued on June 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including post" was invented by Jaekul Lee (Yongin-si, South Korea), Hyungsun Jang (Hwaseong-si, South Korea), Gayoung Kim (Hwaseong-si, South Korea) and Minjeong Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower redistribution layer disposed on a lower surface of the semiconductor chip including an insulating layer, a redistribution pattern, a via, an under bump metal (UBM), and a post disposed on the redistribution pattern. The post vertically overlaps with the UBM. A m...