ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,702, issued on June 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).
"Semiconductor package" was invented by Dongkyu Kim (Anyang-si, South Korea), Seokkyu Choi (Cheonan-si, South Korea), Minjung Kim (Cheonan-si, South Korea) and Seokhyun Lee (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution substrate including a first surface and a second surface that are opposite to each other, an antenna substrate on the first surface and including a first insulating portion and antenna patterns on a top surface of the first insulating portion, and a first semiconduc...