US Patent Issued to SAMSUNG ELECTRONICS on June 3 for "Plasma baffle, substrate processing apparatus including the same, and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,577, issued on June 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Plasma baffle, substrate processing apparatus including the same, and substrate processing method using the same" was invented by Hakyoung Kim (Bucheon-si, South Korea), Dowon Kim (Jecheon-si, South Korea), Jisoo Im (Seongnam-si, South Korea), Youngjin Noh (Ansan-si, South Korea), Chulwoo Park (Suwon-si, South Korea) and Minyoung Hur (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are plasma baffles, substrate processing apparatuses, and substrate processing methods. The plasma baffle comprises a lower ring, an upper ring o...