US Patent Issued to SAMSUNG ELECTRONICS on June 3 for "Housing of electronic device with different bonded metals and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,115, issued on June 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Housing of electronic device with different bonded metals and method of manufacturing the same" was invented by Yoonhee Lee (Suwon-si, South Korea), Youngoh Kim (Suwon-si, South Korea), Juncheol Shin (Suwon-si, South Korea), Seungchang Baek (Suwon-si, South Korea), Sungho Cho (Suwon-si, South Korea) and Hangyu Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover...