ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,870, issued on June 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Ball attachment apparatus" was invented by Youngja Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the su...