ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,124, issued on June 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).
"Solder reflow apparatus" was invented by Byungkeun Kang (Suwon-si, South Korea), Chaein Moon (Suwon-si, South Korea), Youngja Kim (Suwon-si, South Korea) and Youngmin Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer flu...