US Patent Issued to SAMSUNG ELECTRONICS on June 24 for "Semiconductor package with increased thermal dissipation" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,074, issued on June 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package with increased thermal dissipation" was invented by Younglyong Kim (Anyang-si, South Korea), Myungkee Chung (Hwaseong-si, South Korea) and Aenee Jang (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a semiconductor chip, an interposer on the semiconductor chip, and a molding layer covering at least a portion of the semiconductor chip and at least a portion of the interposer may be provided. The interposer includes a interposer substrate and a heat dissipation pattern penetrating t...