ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,131, issued on June 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Hyunmog Park (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a semiconductor structure including: a first bonding semiconductor chip; a second bonding semiconductor chip on the first bonding semiconductor chip, the second bonding semiconductor chip having a cross-section area in a horizontal direction less than a cross-section area of the first bonding semiconductor chip in the horizontal direction; a chip connection pad between the first bonding semiconductor ch...