US Patent Issued to SAMSUNG ELECTRONICS on June 24 for "Interconnect structure, electronic device including the same, and method of manufacturing interconnect structure" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,063, issued on June 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Interconnect structure, electronic device including the same, and method of manufacturing interconnect structure" was invented by Keunwook Shin (Yongin-si, South Korea), Minsu Seol (Seoul, South Korea), Sangwon Kim (Seoul, South Korea), Kyung-Eun Byun (Seongnam-si, South Korea) and Hyeonjin Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are an interconnect structure, an electronic device including the same, and a method of manufacturing the interconnect structure. The interconnect structure includes a dielectric lay...