US Patent Issued to SAMSUNG ELECTRONICS on June 24 for "Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,015, issued on June 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same" was invented by Dong Hoon Kwon (Hwaseong-si, South Korea), Chung Ki Min (Hwaseong-si, South Korea), Bo Un Yoon (Seoul, South Korea) and Ki Hoon Jang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto...