ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,468, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Solder reflow apparatus" was invented by Youngja Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part."
The patent was fil...