US Patent Issued to SAMSUNG ELECTRONICS on June 17 for "Semiconductor test device and system and test method using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,298, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor test device and system and test method using the same" was invented by Meehyun Lim (Seoul, South Korea), Sungyeol Kim (Yongin-si, South Korea), Hyungjung Yong (Seongnam-si, South Korea) and Jinyeong Yun (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a te...