ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,477, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).
"Semiconductor packages" was invented by Jinnam Kim (Suwon-si, South Korea), Seokho Kim (Suwon-si, South Korea), Hoonjoo Na (Suwon-si, South Korea) and Kwangjin Moon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first structure including a first semiconductor chip comprising a first semiconductor integrated circuit, and a second structure on the first structure. The second structure includes a second semiconductor chip including a second semiconductor integrated circuit, a semiconductor pattern horizontally s...