US Patent Issued to SAMSUNG ELECTRONICS on June 17 for "Semiconductor devices and methods of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,437, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices and methods of fabricating the same" was invented by Kyounghun Ryu (Gumi-si, South Korea), Shin Kwon (Yongin-si, South Korea), Byoungjae Bae (Hwaseong-si, South Korea), Hyunchul Shin (Seoul, South Korea) and Gawon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate including a first region and a second region, data storage patterns on the first region and spaced apart from each other in a first direction, an upper insulating layer on the first and second regions and on ...