US Patent Issued to SAMSUNG ELECTRONICS on June 17 for "Semiconductor devices and manufacturing methods of the same" (South Korean Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,471, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor devices and manufacturing methods of the same" was invented by Hyun Mog Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first substrate structure and a second substrate structure. The first substrate structure includes a base substrate, circuit elements disposed on the base substrate, a first substrate disposed on the circuit elements, first memory cells disposed on the first substrate and electrically connected to the circuit elements, first bit lines disposed on the first memory cell...