US Patent Issued to SAMSUNG ELECTRONICS on June 17 for "Method of manufacturing light emitting device package and method of manufacturing display panel using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,346, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Method of manufacturing light emitting device package and method of manufacturing display panel using the same" was invented by Tan Sakong (Seoul, South Korea) and Juhyun Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a light emitting device package and a method of manufacturing a display panel, the method of manufacturing a light emitting device package including forming a semiconductor laminate on a substrate such that the semiconductor laminate has a first conductive semiconductor layer, an active layer, and a sec...