US Patent Issued to SAMSUNG ELECTRONICS on June 17 for "Method of fabricating a semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,445, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of fabricating a semiconductor package" was invented by Myungsam Kang (Hwaseong-si, South Korea), Youngchan Ko (Seoul, South Korea) and Taesung Jeong (Osan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and associated methods, the package including a substrate; first and second semiconductor chips on the substrate; and external terminals below the substrate, wherein the substrate includes a core portion; first and second buildup portions on top and bottom surfaces of the core portion, the first and second buil...