US Patent Issued to SAMSUNG ELECTRONICS on June 17 for "Electronic device comprising printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,087, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).

"Electronic device comprising printed circuit board" was invented by Haekeu Park (Suwon-si, South Korea), Hyeonyeong Jeong (Suwon-si, South Korea) and Sunghoon Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a microphone module and a printed circuit board on which the microphone module is disposed. The printed circuit board includes a first layer having at least one first microphone pad coupled to the microphone module, a first ground spaced apart from the first microphone pad, and a second micropho...