US Patent Issued to SAMSUNG ELECTRONICS on June 10 for "Semiconductor package including redistribution substrate" (South Korean Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,824, issued on June 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including redistribution substrate" was invented by Dongkyu Kim (Anyang-si, South Korea), Daeho Lee (Hwaseong-si, South Korea), Seokhyun Lee (Hwaseong-si, South Korea), Minjung Kim (Gyeonggi-do, South Korea) and Taewon Yoo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower semiconductor chip disposed on a lower redistribution substrate, lower solder patterns disposed between the lower redistribution substrate and the lower semiconductor chip, conductive structures disposed on th...