ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,784, issued on June 10, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).
"Semiconductor package" was invented by Sangcheon Park (Hwaseong-si, South Korea), Heonwoo Kim (Cheonan-si, South Korea), Sungwoo Park (Seongnam-si, South Korea) and Chajea Jo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an interposer substrate on a package substrate. The interposer substrate includes an upper pad on an upper surface of the insulating layer, a lower pad on a lower surface of the insulating layer, and a redistribution structure penetrating the insulating layer between the upper surface and the ...