ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,826, issued on June 10, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Yongkoon Lee (Suwon-si, South Korea), Myungsam Kang (Hwaseong-si, South Korea) and Youngchan Ko (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an antenna structure including an antenna member configured to transmit and receive a signal through the first surface in the dielectric layer, a connection via extending from the antenna member toward the second surface, and a ground member spaced apart from the connection via; a frame surrounding the side surface of the ...