US Patent Issued to SAMSUNG ELECTRONICS on June 10 for "Integrated circuit devices and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,937, issued on June 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Integrated circuit devices and methods of manufacturing the same" was invented by Jaemun Kim (Seoul, South Korea), Gyeom Kim (Hwaseong-si, South Korea), Dahye Kim (Yongin-si, South Korea), Jinbum Kim (Seoul, South Korea), Kyungin Choi (Seoul, South Korea), Ilgyou Shin (Anyang-si, South Korea) and Seunghun Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes: a fin-type active area protruding from a substrate, extending in a first direction parallel to an upper surface of the substrate, and inclu...