US Patent Issued to SAMSUNG ELECTRONICS on July 8 for "Semiconductor package including photo imageable dielectric" (South Korean Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,974, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including photo imageable dielectric" was invented by Yuseon Heo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a frame, a semiconductor chip, a through via, a connection pad, a lower redistribution layer on the bottom surfaces of the frame and the semiconductor chip, a connection terminal on the lower redistribution layer, an encapsulant covering the top surfaces of the frame and the semiconductor chip, and an upper redistribution layer on the encapsulant. The lower redistribution...