US Patent Issued to SAMSUNG ELECTRONICS on July 8 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,005, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor package and method of fabricating the same" was invented by Jongho Park (Cheonan-si, South Korea), Un-Byoung Kang (Hwaseong-si, South Korea), Sechul Park (Bucheon-si, South Korea), Hyojin Yun (Suwon-si, South Korea), Ju-Il Choi (Seongnam-si, South Korea) and Atsushi Fujisaki (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a substrate that includes a plurality of vias, a first chip stack on the substrate and including a pluralit...