US Patent Issued to SAMSUNG ELECTRONICS on July 8 for "Semiconductor devices and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,899, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor devices and methods of manufacturing the same" was invented by Taeyong Kwon (Suwon-si, South Korea), Yoonjoong Kim (Suwon-si, South Korea), Youngjin Yang (Suwon-si, South Korea) and Dain Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate including a main chip region and a scribe lane region, wherein first trenches are formed in the scribe lane region. A well region doped with impurities is provided on an upper part of the main chip region of the substrate. Align key patterns fo...