ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,987, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).
"Semiconductor device" was invented by Jeonggi Jin (Suwon-si, South Korea), Solji Song (Suwon-si, South Korea), Taehwa Jeong (Suwon-si, South Korea), Jinho Chun (Suwon-si, South Korea), Juil Choi (Suwon-si, South Korea) and Atsushi Fujisaki (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a semiconductor chip, a redistribution layer structure disposed under the semiconductor chip, a bump pad disposed under the redistribution layer structure and having an upper structure of a first width and a lower structure of a s...