US Patent Issued to SAMSUNG ELECTRONICS on July 8 for "Semiconductor chip and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,004, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip and semiconductor package" was invented by Junyeong Heo (Suwon-si, South Korea), Yeongkwon Ko (Hwaseong-si, South Korea), Unbyoung Kang (Hwaseong-si, South Korea) and Teakhoon Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, and an insulating adhesive layer between the first semiconductor chip, and each of the plurality of second semiconductor chips, each of...