US Patent Issued to SAMSUNG ELECTRONICS on July 8 for "Method of fabricating semiconductor device and method of separating substrate" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,879, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of fabricating semiconductor device and method of separating substrate" was invented by Cheonil Park (Seongnam-si, South Korea), Wonkeun Kim (Hwaseong-si, South Korea) and Myoungchul Eum (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrat...