US Patent Issued to SAMSUNG ELECTRONICS on July 8 for "Memory device including memory chip and peripheral memory chip and method of manufacturing the memory device" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,985, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Memory device including memory chip and peripheral memory chip and method of manufacturing the memory device" was invented by Jooyong Park (Hwaseong-si, South Korea), Chanho Kim (Seoul, South Korea), Pansuk Kwak (Seoul, South Korea) and Daeseok Byeon (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device includes a memory chip including a memory cell array connected to first word lines and first bit lines, first word line bonding pads respectively connected to the first word lines, and first bit line bonding pads respecti...