ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,569, issued on July 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Electronic device for moving flexible printed circuit board along support plate during unfolding operation" was invented by Youngsun Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to various example embodiments, a foldable electronic device configured to move a flexible printed circuit board along a support plate during an unfolding operation may include: a hinge configured to support a flexible printed circuit board, wherein the hinge may include: a hinge body, a support plate rotatably connected to the hinge body, a sli...