US Patent Issued to SAMSUNG ELECTRONICS on July 29 for "Substrate processing apparatus and method of fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,885, issued on July 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus and method of fabricating semiconductor device using the same" was invented by Seok Heo (Suwon-si, South Korea), Cha Won Koh (Suwon-si, South Korea), Sang Joon Hong (Suwon-si, South Korea), Hyun Woo Kim (Suwon-si, South Korea), Kyung-Won Kang (Suwon-Si, South Korea), Dong-Wook Kim (Suwon-si, South Korea), Kyung Won Seo (Suwon-si, South Korea), Young Il Jang (Suwon-si, South Korea) and Yong Suk Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a photoresist coa...