US Patent Issued to SAMSUNG ELECTRONICS on July 29 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,667, issued on July 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Junghoon Kang (Anyang-si, South Korea), Byungmin Yu (Sejong-si, South Korea) and Junghyun Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a lower redistribution structure including a lower redistribution insulation layer, a bump pad in the lower redistribution insulation layer, and a lower redistribution pattern electrically connected to the bump pad, wherein the lower redistribution insulation layer includes: one or...