US Patent Issued to SAMSUNG ELECTRONICS on July 29 for "Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,632, issued on July 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure" was invented by Junghoon Lee (Seongnam-si, South Korea) and Kunmo Chu (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanopart...