US Patent Issued to SAMSUNG ELECTRONICS on July 29 for "Image sensor with trench structures filled with a dielectric pattern and overlapped by a light shield pattern" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,405, issued on July 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Image sensor with trench structures filled with a dielectric pattern and overlapped by a light shield pattern" was invented by Seunghyun Song (Suwon-si, South Korea) and Junetaeg Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is an image sensor including a first substrate having first and second surfaces opposite to each other and including a pixel array area that includes unit pixel regions, a pad area that surrounds the pixel array area, and an optical black area between the pixel array area and the pad area, a diele...