US Patent Issued to SAMSUNG ELECTRONICS on July 29 for "Debonding tape and method of processing semiconductor wafer using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,575, issued on July 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Debonding tape and method of processing semiconductor wafer using the same" was invented by Seonho Lee (Cheonan-si, South Korea) and Yeongseok Kim (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A debonding tape includes a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter. The debonding tape includes a second tape layer on the first tape layer and supporting the first tape layer, wherein the second tape layer ...