ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,065, issued on July 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Wafer processing apparatus" was invented by Seungbeom Park (Gwangju, South Korea), Seunghwa Hyun (Suwon-si, South Korea), Kijoo Hong (Seongnam-si, South Korea), Taejoong Kim (Hwaseong-si, South Korea) and Youngkyu Park (Incheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus includes an X-Theta stage unit having a rotary chuck capable of moving in an X direction and rotating in a Theta direction, wherein a wafer is mounted on the rotary chuck and the wafer includes an edge portion adjacent to an edge of the wafer. I...