US Patent Issued to SAMSUNG ELECTRONICS on July 22 for "Semiconductor package and a method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,136, issued on July 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and a method of manufacturing the semiconductor package" was invented by Hyunsu Kim (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including: a package substrate; a spacer chip attached on a surface of the package substrate, the spacer chip having a groove pattern in a surface of the spacer chip; at least one semiconductor chip mounted on the package substrate, the at least one semiconductor chip being attached on the surface of the spacer chip via an adhesive film; and a sealing member...